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Beilstein J. Nanotechnol. 2016, 7, 1871–1877, doi:10.3762/bjnano.7.179
Figure 1: (a) Layout of the dummy chip mimicking the size of the sensor chip and the contact pad positions an...
Figure 2: Schematic image of the isotropic conductive adhesive stamping process, sensor chip mounting, and un...
Figure 3: (a) Bottom side of the LTCC package showing the rear side of the sensor chip. (b) The sensor chip i...
Figure 4: The total resistance of an LTCC packaged dummy chip placed in a cell culture incubator before and a...
Figure 5: Normally proliferating BEAS2B cells on a dummy chip in LTCC package. (a–c) the cells grow on top of...
Figure 6: Average voltage change from the baseline over time from all sensors on one chip after cell media an...